Advances in 3D Integrated Circuits and Systems Hao Yu & Chuan-Seng Tan

By:

Yu, Hao and Tan, Chuan-Seng

Contributor(s):

Tan, Chuan-Seng

9789814699013

Subject(s):

DDC classification:

621.3815 YuA

Summary: 3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs. Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory. Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

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Holdings
Item type	Current library	Collection	Call number	Status	Barcode
Books	Indian Institute of Technology Tirupati General Stacks	Chemical Engineering	621.3815 YuA (12155) (Browse shelf(Opens below))	Available	12155

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3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs. Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory. Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

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