Liu, Jing <br/><br/>
Advanced Liquid Metal Cooling for Chip, Device and System / 
Jing Liu 
 - Singapore :  World Scientific,  ©2022. 
 - xxxiv, 926p. 
<br/><br/><label>ISBN: </label>9789811245855 (hbk) 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Chip<br/>Metal Cooling
<br/><br/><label>Dewey Class. No.: </label>621.381  / LiuA