TY  - GEN
AU  - Liu, Jing
TI  - Advanced Liquid Metal Cooling for Chip, Device and System
SN  - 9789811245855 (hbk)
U1  - 621.381 
PY  - 2022///
CY  - Singapore
PB  - World Scientific
KW  - Chip
KW  - Metal Cooling
ER  -