000			01364 a2200205 4500
005			20251009091713.0
008			251009b |||||||| |||| 00| 0 eng d
020			_a9789814699013
082			_a621.3815 _bYuA
100			_aYu, Hao and Tan, Chuan-Seng
245			_aAdvances in 3D Integrated Circuits and Systems _cHao Yu & Chuan-Seng Tan
260			_bWorld Scientific : _aSingapore , _c©2016.
300			_axvii,375p.
440			_aSeries on Emerging Technologies in Circuits and Systems :
520			_a3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs. Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory. Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.
650			_aPhysical Disign
650			_aThermal Management
700			_aTan, Chuan-Seng
942			_cBK
999			_c6595 _d6595